Parameters |
Attachment Method |
Adhesive |
Shape |
Rectangular |
Length |
4.000" (101.60mm) |
Width |
1.500" (38.10mm) |
Diameter |
- |
Fin Height |
0.008" (0.21mm) |
Power Dissipation @ Temperature Rise |
- |
Thermal Resistance @ Forced Air Flow |
- |
Thermal Resistance @ Natural |
- |
Material |
Copper |
Material Finish |
Polyester |
Shelf Life |
12 Months |
Base Product Number |
PH3-101 |
RoHS Status |
RoHS Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN |
EAR99 |
HTSUS |
7410.21.6000 |
Standard Package |
1 |
Mfr |
t-Global Technology |
Series |
PH3 |
Package |
Bulk |
Product Status |
Obsolete |
Type |
Heat Spreader |
Package Cooled |
Assorted (BGA, LGA, CPU, ASIC...) |
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader