| Parameters |
| Peripherals |
DMA, WDT |
| Connectivity |
CANbus, I²C, SPI, UART/USART, USB |
| Speed |
500MHz, 1.2GHz |
| Primary Attributes |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Operating Temperature |
-40°C ~ 100°C (TJ) |
| Package / Case |
784-BFBGA, FCBGA |
| Supplier Device Package |
784-FCBGA (23x23) |
| Number of I/O |
128 |
| Base Product Number |
XAZU2 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
| ECCN |
5A002A4 XIL |
| HTSUS |
8542.39.0001 |
| Other Names |
122-2064 |
| Standard Package |
1 |
| Mfr |
AMD |
| Series |
Zynq® UltraScale+™ MPSoC EG |
| Package |
Tray |
| Product Status |
Active |
| Architecture |
MPU, FPGA |
| Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Flash Size |
- |
| RAM Size |
1.2MB |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 500MHz, 1.2GHz 784-FCBGA (23x23)