| Parameters |
| Mfr |
Aries Electronics |
| Series |
EJECT-A-DIP™ |
| Package |
- |
| Product Status |
Active |
| Type |
DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) |
28 (2 x 14) |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
10.0µin (0.25µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
Closed Frame |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Gold |
| Contact Finish Thickness - Post |
10.0µin (0.25µm) |
| Contact Material - Post |
Brass |
| Housing Material |
Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature |
-55°C ~ 125°C |
| Termination Post Length |
0.125" (3.18mm) |
| Material Flammability Rating |
UL94 V-0 |
| Current Rating (Amps) |
3 A |
| Contact Resistance |
- |
| Base Product Number |
28-C182 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8536.69.4040 |
| Standard Package |
1 |
28 (2 x 14) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole