Parameters |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
Shipping Info |
- |
RoHS Status |
RoHS Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
ECCN |
EAR99 |
HTSUS |
8311.90.0000 |
Standard Package |
10 |
Mfr |
Harimatec Inc. |
Series |
HF212 |
Package |
Bulk |
Product Status |
Obsolete |
Type |
Solder Paste |
Composition |
SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
Diameter |
- |
Melting Point |
408 ~ 424°F (209 ~ 218°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Mesh Type |
- |
Process |
Lead Free |
Form |
Jar, 17.64 oz (500g) |
Shelf Life |
6 Months |
Lead Free No-Clean Solder Paste SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Jar, 17.64 oz (500g)