| Parameters |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
- |
| Digi-Key Storage |
- |
| Shipping Info |
- |
| RoHS Status |
RoHS Compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| ECCN |
EAR99 |
| HTSUS |
8311.90.0000 |
| Standard Package |
10 |
| Mfr |
Harimatec Inc. |
| Series |
HF212 |
| Package |
Bulk |
| Product Status |
Obsolete |
| Type |
Solder Paste |
| Composition |
SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
| Diameter |
- |
| Melting Point |
408 ~ 424°F (209 ~ 218°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
- |
| Mesh Type |
- |
| Process |
Lead Free |
| Form |
Jar, 17.64 oz (500g) |
| Shelf Life |
6 Months |
Lead Free No-Clean Solder Paste SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 Jar, 17.64 oz (500g)