Parameters |
Mfr |
Kester Solder |
Series |
NP560 |
Package |
Bulk |
Product Status |
Active |
Type |
Solder Paste |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
- |
Melting Point |
423 ~ 424°F (217 ~ 218°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Mesh Type |
4 |
Process |
Lead Free |
Form |
Syringe, 3.53 oz (100g) |
Shelf Life |
12 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
32°F ~ 50°F (0°C ~ 10°C) |
Digi-Key Storage |
Refrigerated |
Shipping Info |
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Weight |
- |
Base Product Number |
70-4825 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.90.0000 |
Standard Package |
1 |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 3.53 oz (100g)