Parameters |
Mfr |
Canfield Technologies |
Series |
- |
Package |
Spool |
Product Status |
Active |
Type |
Wire Solder |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
0.020" (0.51mm) |
Melting Point |
423 ~ 424°F (217 ~ 218°C) |
Flux Type |
No-Clean |
Wire Gauge |
24 AWG, 25 SWG |
Process |
Lead Free |
Form |
Spool, 8 oz (227g), 1/2 lb |
Shelf Life |
24 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
50°F ~ 104°F (10°C ~ 40°C) |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
Other Names |
3844-CC96L2020ESAC |
Standard Package |
1 |
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 8 oz (227g), 1/2 lb