Canfield Technologies CCBLF227L2020 - Canfield Technologies Solder - BOM, Chip Distributor, Quick Quotation 365day Warranty
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PRODUCT

Canfield Technologies CCBLF227L2020

BLF 227 NO CLEAN FLUX 8 OZ .020

  • Manufacturer: Canfield Technologies
  • Manufacturer's number: Canfield Technologies CCBLF227L2020
  • Package: Spool
  • Datasheet: -
  • Stock: 50
  • SKU: CCBLF227L2020
  • Pricing:we created an exceptionally flexible and competitive pricing policy.

Quantity:

Unit Price: $40.8400

Ext Price: $40.8400

Details

Tags

Parameters
Mfr Canfield Technologies
Series -
Package Spool
Product Status Active
Type Wire Solder
Composition BLF 227 (99.17Sn/.8Cu/.03Ni)
Diameter 0.020" (0.51mm)
Melting Point 440°F (227°C)
Flux Type No-Clean
Wire Gauge 24 AWG, 25 SWG
Process Lead Free
Form Spool, 8 oz (227g), 1/2 lb
Shelf Life 24 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 50°F ~ 104°F (10°C ~ 40°C)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
Other Names 3844-CCBLF227L2020
Standard Package 1
Lead Free No-Clean Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 24 AWG, 25 SWG Spool, 8 oz (227g), 1/2 lb