Canfield Technologies RCBLF22701031P - Canfield Technologies Solder - BOM, Chip Distributor, Quick Quotation 365day Warranty
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Canfield Technologies RCBLF22701031P

BLF 227 ROSIN FLUX 1 LB. 031DIA

  • Manufacturer: Canfield Technologies
  • Manufacturer's number: Canfield Technologies RCBLF22701031P
  • Package: Spool
  • Datasheet: -
  • Stock: 50
  • SKU: RCBLF22701031P
  • Pricing:we created an exceptionally flexible and competitive pricing policy.

Quantity:

Unit Price: $58.9200

Ext Price: $58.9200

Details

Tags

Parameters
Mfr Canfield Technologies
Series -
Package Spool
Product Status Active
Type Wire Solder
Composition BLF 227 (99.17Sn/.8Cu/.03Ni)
Diameter 0.031" (0.79mm)
Melting Point 440°F (227°C)
Flux Type Rosin Activated (RA)
Wire Gauge 20 AWG, 22 SWG
Process Lead Free
Form Spool, 1 lb (453.59g)
Shelf Life 24 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 50°F ~ 104°F (10°C ~ 40°C)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
Other Names 3844-RCBLF22701031P
Standard Package 1
Lead Free Rosin Activated (RA) Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 20 AWG, 22 SWG Spool, 1 lb (453.59g)