| Parameters |
| Mfr |
MG Chemicals |
| Series |
4900 |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Solder Paste |
| Composition |
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
| Diameter |
- |
| Melting Point |
423 ~ 430°F (217 ~ 221°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
- |
| Mesh Type |
- |
| Process |
Lead Free |
| Form |
Syringe, 0.88 oz (25g) |
| Shelf Life |
24 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
35°F ~ 50°F (2°C ~ 10°C) |
| Digi-Key Storage |
Refrigerated |
| Shipping Info |
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Base Product Number |
4900 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
3810.10.0000 |
| Standard Package |
1 |
Lead Free No-Clean Solder Paste Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) Syringe, 0.88 oz (25g)