Parameters |
Mfr |
MG Chemicals |
Series |
4900 |
Package |
Bulk |
Product Status |
Active |
Type |
Solder Paste |
Composition |
Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) |
Diameter |
- |
Melting Point |
423 ~ 430°F (217 ~ 221°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Mesh Type |
- |
Process |
Lead Free |
Form |
Syringe, 0.88 oz (25g) |
Shelf Life |
24 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
35°F ~ 50°F (2°C ~ 10°C) |
Digi-Key Storage |
Refrigerated |
Shipping Info |
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Base Product Number |
4900 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
3810.10.0000 |
Standard Package |
1 |
Lead Free No-Clean Solder Paste Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) Syringe, 0.88 oz (25g)