CUI Devices HSB06-181810 - CUI Devices Thermal - BOM, Chip Distributor, Quick Quotation 365day Warranty
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CUI Devices HSB06-181810

HEAT SINK, BGA, 18 X 18 X 10 MM

  • Manufacturer: CUI Devices
  • Manufacturer's number: CUI Devices HSB06-181810
  • Package: Box
  • Datasheet: PDF
  • Stock: 442
  • SKU: HSB06-181810
  • Pricing:we created an exceptionally flexible and competitive pricing policy.

Quantity:

Unit Price: $1.0200

Ext Price: $1.0200

Details

Tags

Parameters
Mfr CUI Devices
Series HSB
Package Box
Product Status Active
Type Top Mount
Package Cooled BGA
Attachment Method Adhesive
Shape Square, Pin Fins
Length 0.709" (18.00mm)
Width 0.709" (18.00mm)
Diameter -
Fin Height 0.394" (10.00mm)
Power Dissipation @ Temperature Rise 3.2W @ 75°C
Thermal Resistance @ Forced Air Flow 18.80°C/W @ 200 LFM
Thermal Resistance @ Natural 23.68°C/W
Material Aluminum Alloy
Material Finish Black Anodized
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) Not Applicable
REACH Status REACH Unaffected
ECCN EAR99
HTSUS 8473.30.5100
Other Names 2223-HSB06-181810
Standard Package 1,960
Heat Sink BGA Aluminum Alloy 3.2W @ 75°C Top Mount