| Parameters |
| Mfr |
MG Chemicals |
| Series |
4900 |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Solder Paste |
| Composition |
SAC305 |
| Diameter |
- |
| Melting Point |
423 ~ 430°F (217 ~ 221°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
- |
| Mesh Type |
- |
| Process |
Lead Free |
| Form |
Jar, 8.8 oz (250g) |
| Shelf Life |
24 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
35°F ~ 50°F (2°C ~ 10°C) |
| Base Product Number |
4900 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.3000 |
| Standard Package |
1 |
Lead Free No-Clean Solder Paste SAC305 Jar, 8.8 oz (250g)