Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Jar |
Product Status |
Active |
Type |
Solder Paste |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
- |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Mesh Type |
3 |
Process |
Lead Free |
Form |
Jar, 8.8 oz (250g) |
Shelf Life |
6 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
37°F ~ 46°F (3°C ~ 8°C) |
Digi-Key Storage |
Refrigerated |
Shipping Info |
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Weight |
0.551 lb (249.93 g) |
Base Product Number |
SMD291 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.30.6000 |
Standard Package |
1 |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)