Parameters |
Mfr |
Aries Electronics |
Series |
0513 |
Package |
Bulk |
Product Status |
Active |
Type |
SIP |
Number of Positions or Pins (Grid) |
25 (1 x 25) |
Pitch - Mating |
0.100" (2.54mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
10.0µin (0.25µm) |
Contact Material - Mating |
Beryllium Copper |
Mounting Type |
Through Hole |
Features |
- |
Termination |
Solder |
Pitch - Post |
0.100" (2.54mm) |
Contact Finish - Post |
Tin |
Contact Finish Thickness - Post |
200.0µin (5.08µm) |
Contact Material - Post |
Brass |
Housing Material |
Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature |
- |
Termination Post Length |
0.125" (3.18mm) |
Material Flammability Rating |
UL94 V-0 |
Current Rating (Amps) |
3 A |
Contact Resistance |
- |
Base Product Number |
25-0513 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8536.69.4040 |
Standard Package |
1 |
25 (1 x 25) Pos SIP Socket Gold Through Hole