| Parameters |
| Mfr |
Infineon Technologies |
| Series |
XENSIV™ |
| Package |
Tape & Reel (TR) |
| Product Status |
Active |
| Type |
MEMS (Silicon) |
| Output Type |
Digital, PDM |
| Direction |
Noise Cancelling |
| Sensitivity |
-36dB ±1dB @ 94dB SPL |
| S/N Ratio |
72dB |
| Voltage Range |
1.62 V ~ 3.6 V |
| Current - Supply |
980 µA |
| Port Location |
Bottom |
| Ratings |
IP57 - Dust Protected, Waterproof |
| Termination |
Solder Pads |
| Size / Dimension |
0.157" L x 0.118" W (4.00mm x 3.00mm) |
| Height (Max) |
0.047" (1.20mm) |
| Shape |
Rectangular |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8518.10.8030 |
| Standard Package |
1,000 |
Digital, PDM Microphone MEMS (Silicon) 1.62 V ~ 3.6 V Noise Cancelling (-36dB ±1dB @ 94dB SPL) Solder Pads