| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
- |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Wire Solder |
| Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter |
0.015" (0.38mm) |
| Melting Point |
423 ~ 428°F (217 ~ 220°C) |
| Flux Type |
No-Clean, Water Soluble |
| Wire Gauge |
27 AWG, 28 SWG |
| Process |
Lead Free |
| Form |
Spool, 8 oz (227g), 1/2 lb |
| Shelf Life |
- |
| Shelf Life Start |
- |
| Storage/Refrigeration Temperature |
- |
| Digi-Key Storage |
- |
| Shipping Info |
- |
| Base Product Number |
SMDSW |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.6000 |
| Standard Package |
1 |
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 27 AWG, 28 SWG Spool, 8 oz (227g), 1/2 lb