iWave Systems IW-HSKALU-CLASLR-CU03 - iWave Systems Thermal - BOM, Chip Distributor, Quick Quotation 365day Warranty
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iWave Systems IW-HSKALU-CLASLR-CU03

ZU+ MPSOC SOM MODULE HEATSINK

  • Manufacturer: iWave Systems
  • Manufacturer's number: iWave Systems IW-HSKALU-CLASLR-CU03
  • Package: Bulk
  • Datasheet: -
  • Stock: 10
  • SKU: IW-HSKALU-CLASLR-CU03
  • Pricing:we created an exceptionally flexible and competitive pricing policy.

Quantity:

Unit Price: $55.0000

Ext Price: $55.0000

Details

Tags

Parameters
Mfr iWave Systems
Series -
Package Bulk
Product Status Active
Type Top Mount
Package Cooled FPGA
Attachment Method Bolt On
Shape Rectangular, Fins
Length 3.740" (95.00mm)
Width 2.953" (75.00mm)
Diameter -
Fin Height 1.181" (30.00mm)
Power Dissipation @ Temperature Rise -
Thermal Resistance @ Forced Air Flow -
Thermal Resistance @ Natural -
Material Aluminum
Material Finish -
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN EAR99
HTSUS 7616.99.9000
Other Names 2503-IW-HSKALU-CLASLR-CU03
Standard Package 1
Heat Sink FPGA Aluminum Top Mount