| Parameters |
| Mfr |
Laird Technologies EMI |
| Series |
Tflex™ 300 |
| Package |
Bulk |
| Product Status |
Active |
| Usage |
- |
| Type |
Gap Filler Pad, Sheet |
| Shape |
Square |
| Outline |
457.20mm x 457.20mm |
| Thickness |
0.200" (5.08mm) |
| Material |
Silicone, Ceramic Filled |
| Adhesive |
- |
| Backing, Carrier |
- |
| Color |
Green |
| Thermal Resistivity |
- |
| Thermal Conductivity |
1.2W/m-K |
| Shelf Life |
24 Months |
| Shelf Life Start |
Date of Shipment |
| Storage/Refrigeration Temperature |
- |
| Digi-Key Storage |
- |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| ECCN |
EAR99 |
| HTSUS |
8546.90.0000 |
| Standard Package |
1 |
Thermal Pad Green 457.20mm x 457.20mm Square