Parameters | |
---|---|
Mfr | Laird Technologies - Thermal Materials |
Series | Tpli™ 200 |
Package | Bulk |
Product Status | Active |
Usage | - |
Type | Gap Filler Pad, Sheet |
Shape | Square |
Outline | 406.40mm x 406.40mm |
Thickness | 0.160" (4.06mm) |
Material | Boron Nitride Filled |
Adhesive | - |
Backing, Carrier | - |
Color | Gray |
Thermal Resistivity | - |
Thermal Conductivity | 6.0W/m-K |
Shelf Life | 24 Months |
Shelf Life Start | Date of Shipment |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
RoHS Status | ROHS3 Compliant |
Other Names | 926-A10108-03 |
Standard Package | 1 |