Parameters |
Mfr |
Laird Technologies - Thermal Materials |
Series |
Tpli™ 200 |
Package |
Bulk |
Product Status |
Active |
Usage |
- |
Type |
Gap Filler Pad, Sheet |
Shape |
Square |
Outline |
203.20mm x 203.20mm |
Thickness |
0.0390" (0.991mm) |
Material |
Boron Nitride Filled |
Adhesive |
Adhesive - One Side |
Backing, Carrier |
- |
Color |
- |
Thermal Resistivity |
- |
Thermal Conductivity |
6.0W/m-K |
Shelf Life |
24 Months |
Shelf Life Start |
Date of Shipment |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
Other Names |
926-A10222-02 |
Standard Package |
1 |
Thermal Pad 203.20mm x 203.20mm Square Adhesive - One Side