Parameters |
Mfr |
Laird Technologies - Thermal Materials |
Series |
Tflex™ SF10 |
Package |
Bulk |
Product Status |
Active |
Usage |
- |
Type |
Gap Filler Pad, Sheet |
Shape |
Square |
Outline |
229.00mm x 229.00mm |
Thickness |
0.0492" (1.250mm) |
Material |
Non-Silicone, Ceramic Filled |
Adhesive |
- |
Backing, Carrier |
- |
Color |
Gray |
Thermal Resistivity |
- |
Thermal Conductivity |
10W/m-K |
Shelf Life |
12 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
ECCN |
EAR99 |
HTSUS |
3919.90.5060 |
Other Names |
926-A18213-05 |
Standard Package |
1 |
Thermal Pad Gray 229.00mm x 229.00mm Square