| Parameters |
| Mfr |
Laird Technologies - Thermal Materials |
| Series |
Tflex™ SF10 |
| Package |
Bulk |
| Product Status |
Active |
| Usage |
- |
| Type |
Gap Filler Pad, Sheet |
| Shape |
Square |
| Outline |
229.00mm x 229.00mm |
| Thickness |
0.177" (4.50mm) |
| Material |
Non-Silicone, Ceramic Filled |
| Adhesive |
- |
| Backing, Carrier |
- |
| Color |
Gray |
| Thermal Resistivity |
- |
| Thermal Conductivity |
10W/m-K |
| Shelf Life |
12 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
- |
| Digi-Key Storage |
- |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| ECCN |
EAR99 |
| HTSUS |
3919.90.5060 |
| Other Names |
926-A18213-18 |
| Standard Package |
1 |
Thermal Pad Gray 229.00mm x 229.00mm Square