Parameters |
Mfr |
Laird Technologies - Thermal Materials |
Series |
Tflex™ UT20000 |
Package |
Bulk |
Product Status |
Active |
Usage |
- |
Type |
Gap Filler Pad, Sheet |
Shape |
Square |
Outline |
457.20mm x 457.20mm |
Thickness |
0.0400" (1.016mm) |
Material |
Silicone, Ceramic Filled |
Adhesive |
- |
Backing, Carrier |
- |
Color |
Gray |
Thermal Resistivity |
- |
Thermal Conductivity |
3.0W/m-K |
Shelf Life |
24 Months |
Shelf Life Start |
Date of Shipment |
Storage/Refrigeration Temperature |
- |
Base Product Number |
A17669 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
ECCN |
EAR99 |
HTSUS |
3921.90.4090 |
Other Names |
926-1800 |
Standard Package |
1 |
Thermal Pad Gray 457.20mm x 457.20mm Square