| Parameters |
| Mfr |
Harimatec Inc. |
| Series |
HF250DP |
| Package |
Bulk |
| Product Status |
Obsolete |
| Type |
Solder Paste |
| Composition |
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) |
| Diameter |
- |
| Melting Point |
423°F (217°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
- |
| Mesh Type |
- |
| Process |
Lead Free |
| Form |
Cartridge, 0.88 oz (25g) |
| Shelf Life |
- |
| Shelf Life Start |
- |
| Storage/Refrigeration Temperature |
- |
| Digi-Key Storage |
- |
| Shipping Info |
- |
| RoHS Status |
RoHS Compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| ECCN |
EAR99 |
| HTSUS |
8311.90.0000 |
| Standard Package |
10 |
Lead Free No-Clean Solder Paste Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Cartridge, 0.88 oz (25g)