Parameters |
Mfr |
Chip Quik Inc. |
Series |
SMD2 |
Package |
Bulk |
Product Status |
Active |
Type |
Solder Sphere |
Composition |
Sn63Pb37 (63/37) |
Diameter |
0.020" (0.51mm) |
Melting Point |
361°F (183°C) |
Flux Type |
- |
Wire Gauge |
- |
Process |
Leaded |
Form |
Jar |
Shelf Life |
24 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
RoHS Status |
RoHS non-compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.30.3000 |
Standard Package |
1 |
Leaded Solder Sphere Sn63Pb37 (63/37) Jar