
| Parameters | |
|---|---|
| Mfr | Seeed Technology Co., Ltd |
| Series | uArm |
| Package | Bulk |
| Product Status | Obsolete |
| Configuration | Arm |
| Utilized IC / Part | ATmega2560 |
| Interconnect System | - |
| Suggested Programming Environment | - |
| Included MCU/MPU Board(s) | - |
| Contents | Bluetooth Module, Components, Hardware, uArm(s) |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | EAR99 |
| HTSUS | 8479.50.0000 |
| Standard Package | 1 |







