Parameters | |
---|---|
Mfr | Laird Technologies EMI |
Series | SMD Grounding Metallized |
Package | Tape & Reel (TR) |
Product Status | Active |
Type | Film Over Foam |
Shape | Hourglass |
Width | 0.197" (5.00mm) |
Length | 0.197" (5.00mm) |
Height | 0.197" (5.00mm) |
Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
Plating | - |
Plating - Thickness | - |
Attachment Method | Solder |
Operating Temperature | -40°C ~ 70°C |
Shelf Life Start | - |
Shelf Life | 24 Months |
Storage/Refrigeration Temperature | - |
RoHS Status | RoHS Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |
ECCN | EAR99 |
HTSUS | 8536.90.4000 |
Standard Package | 1,000 |