Winbond Electronics W66BP6NBUAGJ

IC DRAM 2GBIT LVSTL 11 200WFBGA

Manufacturer: Winbond Electronics
Manufacturer's number: Winbond Electronics W66BP6NBUAGJ
Package: Tray
Datasheet: PDF
Stock: 3834
SKU: W66BP6NBUAGJ
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Details

Parameters
Other Names	256-W66BP6NBUAGJ
Standard Package	144
Mfr	Winbond Electronics
Series	-
Package	Tray
Product Status	Active
Memory Type	Volatile
Memory Format	DRAM
Technology	SDRAM - Mobile LPDDR4
Memory Size	2Gbit
Memory Organization	128M x 16
Memory Interface	LVSTL_11
Clock Frequency	1.866 GHz
Write Cycle Time - Word, Page	18ns
Access Time	3.5 ns
Voltage - Supply	1.06V ~ 1.17V, 1.7V ~ 1.95V
Operating Temperature	-40°C ~ 105°C (TC)
Mounting Type	Surface Mount
Package / Case	200-WFBGA
Supplier Device Package	200-WFBGA (10x14.5)
Base Product Number	W66BP6
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.32.0036

SDRAM - Mobile LPDDR4 Memory IC 2Gbit LVSTL_11 1.866 GHz 3.5 ns 200-WFBGA (10x14.5)