Parameters | |
---|---|
Mfr | Aries Electronics |
Series | 55 |
Package | Bulk |
Product Status | Active |
Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid) | 28 (2 x 14) |
Pitch - Mating | 0.100" (2.54mm) |
Contact Finish - Mating | Tin |
Contact Finish Thickness - Mating | 200.0µin (5.08µm) |
Contact Material - Mating | Beryllium Copper |
Mounting Type | Through Hole |
Features | Closed Frame |
Termination | Solder |
Pitch - Post | 0.100" (2.54mm) |
Contact Finish - Post | Tin |
Contact Finish Thickness - Post | 200.0µin (5.08µm) |
Contact Material - Post | Beryllium Copper |
Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature | -65°C ~ 105°C |
Termination Post Length | 0.110" (2.78mm) |
Material Flammability Rating | UL94 V-0 |
Current Rating (Amps) | 1 A |
Contact Resistance | - |
Base Product Number | 28-3554 |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8536.69.4040 |
Other Names | Q6708658 |
Standard Package | 9 |
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