Parameters |
Mounting Type |
Through Hole |
Features |
Closed Frame |
Termination |
Solder |
Pitch - Post |
0.100" (2.54mm) |
Contact Finish - Post |
Gold |
Contact Finish Thickness - Post |
30.0µin (0.76µm) |
Contact Material - Post |
Beryllium Copper |
Housing Material |
Polysulfone (PSU), Glass Filled |
Operating Temperature |
-55°C ~ 125°C |
Termination Post Length |
0.154" (3.90mm) |
Material Flammability Rating |
UL94 V-0 |
Current Rating (Amps) |
1 A |
Contact Resistance |
25mOhm |
Base Product Number |
232 |
RoHS Status |
RoHS Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
ECCN |
EAR99 |
HTSUS |
8536.69.4040 |
Standard Package |
10 |
Mfr |
3M |
Series |
Textool™ |
Package |
Bulk |
Product Status |
Obsolete |
Type |
PGA, ZIF (ZIP) |
Number of Positions or Pins (Grid) |
32 (2 x 16) |
Pitch - Mating |
0.100" (2.54mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
30.0µin (0.76µm) |
Contact Material - Mating |
Beryllium Copper |
32 (2 x 16) Pos PGA, ZIF (ZIP) Socket Gold Through Hole