| Parameters |
| Mfr |
Aries Electronics |
| Series |
PGM |
| Package |
Bulk |
| Product Status |
Active |
| Type |
PGA |
| Number of Positions or Pins (Grid) |
- |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
10.0µin (0.25µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
- |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Tin |
| Contact Finish Thickness - Post |
200.0µin (5.08µm) |
| Contact Material - Post |
Brass |
| Housing Material |
Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature |
-55°C ~ 105°C |
| Termination Post Length |
0.165" (4.19mm) |
| Material Flammability Rating |
UL94 V-0 |
| Current Rating (Amps) |
3 A |
| Contact Resistance |
- |
| Base Product Number |
209-PGM |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8536.69.4040 |
| Standard Package |
1 |
Pos PGA Socket Gold Through Hole