NXP USA Inc. BSP100,135

BSP100,135

Manufacturer: NXP USA Inc.
Manufacturer's number: NXP USA Inc. BSP100,135
Package: Bulk
Datasheet: PDF
Stock: 2516
SKU: BSP100,135
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Details

Parameters
Operating Temperature	-65°C ~ 150°C (TJ)
Mounting Type	Surface Mount
Supplier Device Package	SOT-223
Package / Case	TO-261-4, TO-261AA
RoHS Status	ROHS3 Compliant
ECCN	EAR99
HTSUS	8541.29.0095
Standard Package	4,000
Mfr	NXP USA Inc.
Series	TrenchMOS™
Package	Bulk
Product Status	Obsolete
FET Type	N-Channel
Technology	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	30 V
Current - Continuous Drain (Id) @ 25°C	3.2A (Ta)
Drive Voltage (Max Rds On, Min Rds On)	4.5V, 10V
Rds On (Max) @ Id, Vgs	100mOhm @ 2.2A, 10V
Vgs(th) (Max) @ Id	2.8V @ 1mA
Gate Charge (Qg) (Max) @ Vgs	6 nC @ 10 V
Vgs (Max)	±20V
Input Capacitance (Ciss) (Max) @ Vds	250 pF @ 20 V
FET Feature	-
Power Dissipation (Max)	8.3W (Tc)

N-Channel 30 V 3.2A (Ta) 8.3W (Tc) Surface Mount SOT-223